| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0332
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-091 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2015-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ca46055a27b65f9652fe03ab877bdfa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_050440a29423592d516e200f9e73e692
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa20acd666753d983fcf4210c07713f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb0045d24003e2a9c6df126e51068ac8 |
| publicationDate |
2019-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I661270-B |
| titleOfInvention |
Composition for manufacturing semiconductor device and pattern forming method using the composition for manufacturing semiconductor device |
| abstract |
Provided is a composition for manufacturing a semiconductor device which is excellent in embedding property to a pattern wafer and can reduce a film stress.nn n n Provided is a composition for manufacturing a semiconductor device, which contains a product obtained by mixing a metal compound and hydrogen peroxide in an organic solvent [I], and an organic solvent [II]. The composition for manufacturing a semiconductor device according to the present invention is excellent in embedding into a pattern wafer. Further, when a pattern is formed in a multilayer photoresist process, the film stress can also be reduced. |
| priorityDate |
2014-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |