| abstract |
The invention relates to a method for manufacturing a release film for the manufacturing process of a chip component and a release film prepared by the method. The manufacturing method includes the steps of: (1) preparation of a base film: adding 1000-1600 ppm added particles in a base material to obtain A base film with a thickness of 20-75 μm, the added particles are one or more of silicon dioxide, calcium carbonate, magnesium carbonate, barium carbonate, barium sulfate, alumina, and titanium oxide, and the particle size of the added particles is 500 -1500 nm; (2) preparation of a release agent; (3) preparation of a release film: coating the release agent on the base film to obtain a release film. The surface roughness of the prepared release film Ra≤0.25μm; the coating thickness of the release agent is 60-300nm, and the release force is 2-40g / inch; the residual adhesion rate of the release film is ≥90%, preferably 96%. |