http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I658522-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-603 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00 |
| filingDate | 2015-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_949253fb39a8f0e5a118dcd8012d4418 |
| publicationDate | 2019-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I658522-B |
| titleOfInvention | Electronic component manufacturing method |
| abstract | The invention provides a manufacturing method of an electronic component and an intermediate of the electronic component which can sufficiently reduce the warpage of the connected electronic component. In the manufacturing method of an electronic part, in the arrangement step, heat is applied to the anisotropic conductive adhesive layer at a first temperature higher than the second temperature applied in the connection step, and the bump electrode is pressed into Excessive resin is removed in advance into the conductive adhesive layer. In the disposing step, the anisotropic conductive adhesive layer is not hardened, so the anisotropic conductive adhesive layer follows the shrinkage after the application of heat, and can suppress the warpage of the first circuit member and the second circuit member. In the connecting step following the arranging step, as long as a second temperature lower than the first temperature is applied as an aid for light curing, warpage of the electronic components after the connection can be sufficiently reduced. |
| priorityDate | 2014-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.