http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I658060-B

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G63-199
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
filingDate 2018-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f010e0ef6a8a6e81adbd857f0fc344b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f31c39613e8a958d4d2d6ec2b3750a1
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publicationDate 2019-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I658060-B
titleOfInvention Active polyester containing dicyclopentadiene structure and its low dielectric epoxy tree Fatified product
abstract The present invention provides an active polyester containing a dicyclopentadiene structure and a low dielectric epoxy resin cured product thereof. Among them, the polyester has the following structure: Wherein R 1 and R 2 are selected from the group consisting of a hydrogen group, a C1-C6 alkyl group, a phenyl group and a CF 3 group, and R 3 is or , n is a positive integer of 20-200. Thereby, the dicyclopentadiene and the active ester group are introduced into the polyester main chain, and the epoxy cured product produced has high heat properties and low dielectric properties.
priorityDate 2018-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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