| abstract |
The invention provides a thermosetting resin composition, a prepreg, a metal foil-clad laminate, and a high-frequency circuit board made from the thermosetting resin composition. The thermosetting resin composition includes a low-polar allyl resin and a phosphorus-containing monomer or a phosphorus-containing resin. The copper-clad plate and high-frequency circuit substrate prepared by the method have low dielectric constant and dielectric loss, good heat resistance and flame retardancy. |