| abstract |
A photosensitive resin composition comprising, by weight, 100 parts of epoxy acrylate, 10 to 50 parts of acrylate monomer, 10 to 40 parts of acrylate oligomer, and 5 to 15 parts of light-initiating a pigment, 1 to 5 parts of a colorant, and 10 to 50 parts of a blocked polyisocyanate, wherein the blocked polyisocyanate is obtained by blocking an isocyanate group in a polyisocyanate with a blocking agent, the blocking agent The blocked isocyanate group is deblocked after the blocked polyisocyanate is heated to a deblocking temperature above normal temperature. |