| abstract |
The invention provides a fan-out type semiconductor package comprising: a semiconductor wafer having an active surface on which a connection pad is disposed and an inactive surface opposite to the active surface; and an encapsulation body which encapsulates the inactive surface of the semiconductor wafer. At least in part; an interconnecting component, which is disposed on the active surface of the semiconductor wafer and includes a redistribution layer; a rear redistribution layer, which is embedded in the encapsulation body such that one surface thereof is exposed by the encapsulation body; and a connection component, which The rear redistribution layer and the encapsulation body, wherein the redistribution layer and the rear redistribution layer are connection pads of a semiconductor wafer. |