| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54473 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-402
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d73fddeb26fc0eb13bbd594190fec5ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2c29980f84a6916bc08c9b3f529827b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34c276a997ef97792881bc568c666e00 |
| publicationDate |
2019-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I655684-B |
| titleOfInvention |
Cutting wafers from the back side and front side of the wafer |
| abstract |
Describe the manner in which the backside laser scribing plus front side laser scribing and plasma etching cut the wafer or substrate. For example, a method of dicing a semiconductor wafer having a plurality of integrated circuits on a front side of the semiconductor wafer and a metallization layer on a back side of the semiconductor wafer, the method involving A laser scribe line processes the metallization layer patterned on the back side to provide a first plurality of laser scribe lines on the back side. The method also involves forming a mask on the front side. The method also involves processing the patterned mask from the front side using a second laser scribe line to provide a patterned mask having a second plurality of scribe lines exposed to the semiconductor wafer. An area between the circuits, wherein the second plurality of scribe lines are aligned with the first plurality of scribe lines. The method also involves plasma etching the semiconductor wafer through a second plurality of scribe lines to divide the integrated circuit. |
| priorityDate |
2013-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |