| abstract |
The present invention provides a conductive paste for laser etching processing suitable for laser etching processing, which can reduce high-density electrode circuit wiring with an L / S of 50/50 μm or less, which is difficult to cope with by conventional screen printing methods. Cost-effective, low environmental impact manufacturing and can reduce thermal degradation of the substrate. The present invention provides a conductive paste for laser etching processing, which includes a binder resin (A), a metal powder (B), and an organic solvent (C) composed of a thermoplastic resin. The binder resin (A) is a number average molecular weight. 5,000 to 60,000 thermoplastic resins with a glass transition temperature of less than 60 ° C. Provided are conductive films, conductive laminates, electrical circuits, and touch panels formed using the conductive paste. |