| abstract |
The present invention provides a thermosetting resin composition. It has high withstand voltage insulation and is excellent in heat resistance and storage stability. It is characterized in that it contains: (A) a cyanate compound having two or more cyanogenic groups in one molecule; and (B) a phenolic curing agent containing resorcinol represented by the following Chemical Formula 1 The phenol resin, (C) a compound selected from the group consisting of a tetraphenylborate of a tetrasubstituted fluorene compound and a tetraphenylborate represented by the following Chemical Formula 2.nn n n n n n n n n n In the formula, n represents an integer of 0 or more and 10 or less, and R 1 and R 2 are each independently represented as a monovalent selected from a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, and an allyl group and a vinyl group. Group.n n n n n n n n n n R 3 is selected from a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and a phenyl group, and n is an integer of 1 to 3. |