http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I653920-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e78acdb66e206d602c5d56a0c69981ae |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4688 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 2018-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18b2fa03256f68a0443cdd6d8ffec600 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86c9625ed506c52ba64beff9b53d0d80 |
| publicationDate | 2019-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I653920-B |
| titleOfInvention | Method for manufacturing printed wiring board and protective film |
| abstract | The invention provides a method for manufacturing a printed wiring board and a protective film. The foregoing method can prevent a reduction in etching efficiency and protect an insulating resin film adhered to a metal foil-clad laminate in a plasma treatment step for removing resin residues. A method for manufacturing a printed wiring board according to the present invention includes a step of preparing a single-sided metal-clad laminated board including an insulating base substrate and a metal foil, and a protective film including an insulating resin film and a metal thin film, and bonding the protective film to the substrate. A step of covering a metal foil laminated plate, a step of forming a bottom via hole by irradiating a predetermined portion of the protective film with a laser, a step of removing resin residue by plasma etching, and removing a bottom surface of the bottom via hole by wet etching A step of back-processing a film and a metal thin film, a step of filling a conductive paste in a bottomed via hole using a printing method, and a step of peeling an insulating resin film from an insulating base substrate. |
| priorityDate | 2017-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.