http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I647342-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eec6cec04e090b04d16f1f2a37244b45 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-46 |
| filingDate | 2017-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1de96a79b0b4c022641a3e68aba181b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_856a4dd20e3ee0b8829091b06f746c4c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66715fbd9b7dc64de89fd347348bbf94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_144fb878e033590dc46bb59949459c47 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39eeb1ac7a838460c3bc93a2d1c7ccb8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a25c8deee9dfbf5d43e7f4f1f2e30d4 |
| publicationDate | 2019-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I647342-B |
| titleOfInvention | Copper-silver two-component metal plating liquid for semiconductor wires and plating method |
| abstract | A copper-silver two-component metal plating liquid comprising: copper methanesulfonate, silver methanesulfonate, methanesulfonic acid, chloride ion and water. The invention further provides a plating method for forming a copper-silver two-component metal by using the electroplating liquid, the steps comprising: (a) contacting the copper-silver two-component metal plating liquid with a substrate; (b) applying a working voltage, controlling The voltage has a current density between 0.1 and 2 ASD and the substrate is electroplated. Thereby, the design of the electroplating liquid by the methanesulfonic acid and the methanesulfonate makes the plating solution have environmentally-friendly characteristics such as low poisoning hazard. And in the electroplating, with the adjustment of potential and current, a copper-silver two-component metal plating layer with a specific silver content is obtained. |
| priorityDate | 2017-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.