http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I645959-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234d9ff72968957446fe9a8e3ebc01df http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93bd50287fe3757584a650043bab7b72 |
| publicationDate | 2019-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I645959-B |
| titleOfInvention | Metal foil, metal foil with release layer, laminated body, printed wiring board, semiconductor package, electronic device, and manufacturing method of printed wiring board |
| abstract | In the present invention, the metal foil is provided with a release layer so that the resin substrate when the metal foil is bonded to the resin substrate can be physically peeled off, so that the metal foil can be removed without damage during the step of removing the metal foil from the resin substrate. In the case of the contour of the metal foil surface transferred to the surface of the resin substrate, the metal foil is removed at a better cost. Furthermore, the metal foil can be reattached to the resin substrate after being peeled off and removed once, and the transfer shape of the metal foil surface can be obtained on the resin surface repeatedly or continuously, and printed wiring boards can be produced at a better manufacturing cost. . The metal foil of the present invention can be repeatedly subjected to the step of physically peeling after bonding to the resin substrate. |
| priorityDate | 2015-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 400.