http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I645073-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12438 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D9-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 |
| filingDate | 2010-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04b6b303e68592c885d1aded52c3175c |
| publicationDate | 2018-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I645073-B |
| titleOfInvention | Copper foil and semiconductor package substrate |
| abstract | A copper foil for a semiconductor package substrate, which is a chromic acid treatment layer formed on a roughened surface of a copper foil (being the surface of the resin), or a coating layer composed of zinc or zinc oxide and chromium oxide, and a decane coupling agent. The layer is composed. The copper foil for a semiconductor package substrate is characterized in that the amount of Cr in the chromic acid coating layer is 25-150 μg/dm 2 and the Zn is 150 μg/dm 2 or less. The copper foil for a semiconductor package substrate contains at least one or more kinds of alkane decane and a oxo oxane having a functional group reactive with a resin as a decane coupling agent layer. A problem is to establish an electrolytic treatment technique for a copper foil which can effectively prevent circuit etching when a copper foil is laminated on a resin substrate and a circuit is soft-etched using a sulfuric acid-based etching solution. |
| priorityDate | 2009-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.