http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I644395-B

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02164
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762
filingDate 2010-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5cd36a2bc552b870abcb1d063e7911d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4274bbaa13f35d36885ee03cddb895fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e2304cc49ed41fc8f05d2cc69d77ffc
publicationDate 2018-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I644395-B
titleOfInvention Semiconductor device and method of manufacturing same
abstract The present invention provides a semiconductor device including an element isolation structure that prevents adverse effects on electrical characteristics of a semiconductor element, and a method of fabricating the same. The film thickness of the ruthenium oxide film 9 remaining in the element isolation trench having a relatively narrow width is thinner than that of the ruthenium oxide film 9 remaining in the element isolation trench having a relatively wide width. The amount by which the ruthenium oxide film 9 is thinned is a laminate thickness of the ruthenium oxide film 10 (upper layer) having a higher compressive stress formed by the HDP-CVD method on the lower ruthenium oxide film 9. Finally, the compressive stress of the element isolation oxide film formed in the element isolation trench having a relatively narrow width is further improved.
priorityDate 2009-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 27.