| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-413
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41C1-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2014-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ef0bfb838c9f3b1327d76ee22f743b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_508f5a0924ca8e82dd9da23903f0d017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cafc7bca3f0e7a6f7d28e4f4b3e643a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea7fa9476224819b36add3a8ef26558d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e16b257b0fcff273faade0796ab841b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73d9fa96fae3d2d27bb64b7a8fb158bf |
| publicationDate |
2018-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I643980-B |
| titleOfInvention |
Evaluation of the through-hole electroplating bath using the comparison of the field and the features |
| abstract |
The embodiments herein relate to a method and apparatus for determining whether a specific test plating bath can successfully fill a feature portion on a substrate. In different cases, the substrate is a semiconductor substrate and the feature is a through silicon via. In summary, two experiments are used: the first experiment simulates the conditions that exist in the field region of the substrate during the filling process, and the second experiment simulates the conditions that exist in the feature portions on the substrate during the filling process. The results from these experiments can be used with different techniques to predict whether a particular plating bath will result in fully filled features. |
| priorityDate |
2013-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |