| abstract |
The present invention relates to a liquid epoxy resin composition for semiconductor encapsulation which comprises the following (A) to (D), and (A) a liquid epoxy resin which does not contain a decane bond in a molecule, (B) an acid anhydride-based curing agent, and (C) a surface-treated spherical inorganic filler, which is a spherical filler having an average particle diameter of 0.1 to 10 μm as measured by a laser diffraction method, and is used as an inorganic filler. 100 parts by mass of the spherical inorganic filler of the component (C), and the surface-treated spherical inorganic filler is surface-treated by a (meth)acrylic acid functional decane coupling agent at a ratio of 0.5 to 2.0 parts by mass. D) A curing accelerator, according to the present invention, can provide a semiconductor device excellent in heat resistance and moisture resistance. |