| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 |
| filingDate |
2015-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecb73e35036bd94df6f7f95bb1ea7c23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65d44d073fd68554e33e7243b991d1a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d73fddeb26fc0eb13bbd594190fec5ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34c276a997ef97792881bc568c666e00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2c29980f84a6916bc08c9b3f529827b |
| publicationDate |
2018-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I642509-B |
| titleOfInvention |
Hybrid wafer cutting method and system using time-controlled laser scribing process and plasma etching |
| abstract |
The present invention describes a method of dicing a semiconductor wafer, and each wafer has a plurality of integrated circuits. In one embodiment, a method for dicing a semiconductor wafer having a plurality of integrated circuits includes forming a mask on a semiconductor wafer, the mask including a film layer covering and protecting the integrated circuits. The method also includes patterning the mask using a time-controlled laser scribing process to provide a patterned mask having a gap, exposing a region of the semiconductor wafer interposed between the integrated circuits. The time controlled laser scribing process includes scribing using a laser beam having a pattern comprising: a leading femtosecond laser portion and a lower intensity and higher flux portion of the tail. The method also includes cutting the integrated circuits by plasma etching the semiconductor wafer through the slits in the patterned mask. |
| priorityDate |
2014-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |