http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I641104-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c142e57962f1e8e9a64926e72f1fd250
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54413
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68354
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54433
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-1876
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-22
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544
filingDate 2013-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ece17502fa9c221e949c3880c2b917c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f871e53726d8eadbb051ca5e7e60ed02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e6d9094a02a93435aca085b6b20e75d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6d2461a31330dcd2a6f93ced824580b
publicationDate 2018-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I641104-B
titleOfInvention Packaging structure of semiconductor components
abstract An arrangement packaging structure of a semiconductor component, comprising: a first layer having a first surface and a second surface; a second layer having a first region and a second region; and a plurality of semiconductor components being located on the first layer and Between the second regions, wherein the shape of the second region comprises a curve and a mark.
priorityDate 2012-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415729521
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID61067

Total number of triples: 36.