| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c72d118f5664072de841f9c5c34b9d99 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H49-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H59-0009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P1-127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P1-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H49-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H59-00 |
| filingDate |
2016-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_838c56d56b2799e446633ce16d3f938b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc2f4cfae5536429fe4a94b8b82672da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d68a55cd320f3d0b074693b56a40c56c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9b2eea21a438105609c0e5287aeef01 |
| publicationDate |
2018-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I641015-B |
| titleOfInvention |
Radio frequency micro electro mechanical system with inverted microstrip transmission line and manufacturing method thereof |
| abstract |
A radio frequency (RF) microelectromechanical system (MEMS) package includes: a first mounting substrate; a signal line formed on a top surface of the first mounting substrate, the signal line including the first portion of the signal line a MEMS device selectively electrically coupled to one of the second portions of the signal line; and a grounding assembly coupled to the first mounting substrate. The grounding assembly includes: a second mounting substrate; a ground plane formed on a bottom surface of the second mounting substrate; and at least one electrical interconnect extending through a thickness of the second mounting substrate To contact the ground plane, wherein the ground plane is spaced apart from the signal line. |
| priorityDate |
2015-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |