| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7069dd48d58212522b73e67b88c8ebe3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate |
2014-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6087e6bacd862dfa11c31979e32c49c3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_781b02a25486f180e7bbf1ee6310983a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f29b93c70c83b86788bfda1c8da5cd24 |
| publicationDate |
2018-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I640569-B |
| titleOfInvention |
Epoxy resin composition, encapsulating material, hardened material thereof and phenol resin |
| abstract |
The epoxy resin composition of the present invention is characterized in that it contains at least an epoxy resin and a phenol resin represented by a specific chemical formula (1). The epoxy resin composition preferably further contains an inorganic filler. Further, it is also preferred that the blending ratio of the inorganic filler in the epoxy resin composition [the mass of the inorganic filler/the mass of the epoxy resin composition containing the inorganic filler] is 70 to 95% by mass. Further, it is also preferred to contain a solvent, and the epoxy resin and the phenol resin are uniformly dissolved in the solvent. |
| priorityDate |
2013-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |