| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-402
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31105 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2014-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c1abb4654607c7168977a6b8a758791
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34c276a997ef97792881bc568c666e00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95158a0dceb2929231588aef058daf81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d73fddeb26fc0eb13bbd594190fec5ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7470fb66e90497c4b09c779900019808
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2c29980f84a6916bc08c9b3f529827b |
| publicationDate |
2018-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I640037-B |
| titleOfInvention |
Laser and plasma etched wafer dicing with etch chamber shadow ring for thin film frame wafer applications |
| abstract |
This document describes masking laser and plasma etched wafer dicing that covers the integrated circuitry formed on the wafer and any bumps that provide an interface to the integrated circuitry. The semiconductor wafer is coupled to the film frame by an adhesive film. The mask is patterned by laser scribing to provide a patterned mask with a gap. The laser scribes the area of the semiconductor wafer exposed below the film layer from which the integrated circuit is formed. When the film frame is maintained at an acceptable low temperature using the chamber shadow ring, the semiconductor wafer is plasma etched through the gaps in the patterned mask, the chamber shadow ring being configured to mount and cover the frame beyond the edge of the wafer. The shadow ring can be raised and lowered, for example, on the lift pins to facilitate transfer of the wafer over the frame. |
| priorityDate |
2013-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |