| abstract |
The present invention discloses a resin composition comprising a specific compound having at least two DOPO functional groups or a combination thereof as a flame retardant, and an aliphatic long-chain maleimide compound. The resin composition can be made into various articles such as a prepreg, a resin film, a resin film with a copper foil, a laminate or a printed circuit board, and has moldability, multiple press reliability, chemical resistance, and heat resistance. At least one, many or all of the characteristics of dielectric constant, dielectric loss, interlayer adhesion, and storage modulus are well improved. |