| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41F15-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38 |
| filingDate |
2014-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65d44d073fd68554e33e7243b991d1a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2c29980f84a6916bc08c9b3f529827b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34c276a997ef97792881bc568c666e00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d20730bb1754f48e1ac88926dc11acff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d73fddeb26fc0eb13bbd594190fec5ec |
| publicationDate |
2018-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I639186-B |
| titleOfInvention |
Mesh print mask for laser scribing and plasma etching wafer cutting processes |
| abstract |
A method of using a mesh printed mask for hybrid wafer cutting using laser scribing and plasma etching is described. In one example, a method of cutting a semiconductor wafer (the semiconductor wafer having a plurality of integrated circuits separated by a scribe line) includes: mesh printing a patterned mask over the semiconductor wafer, A patterned mask covers the integrated circuits and exposes the scribe lines of the semiconductor wafer. The method also includes laser ablation of the scribe lines by a laser scribing process to expose regions of the semiconductor wafer between the integrated circuits. The method also includes plasma etching the semiconductor wafer through the exposed regions of the semiconductor wafer to singulate the integrated circuits. The patterned mask protects the integrated circuits during the plasma etch. |
| priorityDate |
2013-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |