| abstract |
The present invention provides a process for processing a workpiece, such as a process of debonding a bonded stack, and the like, and a device designed to implement the process. The process includes (1) preparing a bond stack including a carrier layer, a workpiece layer, and an interposer therebetween; (2) processing the workpiece layer; and (3) delivering a gas jet to the stack The junction between adjacent layers to separate or unbond the two adjacent layers. Technical advantages of the present invention include increased process efficiency, higher wafer processing yield, reduced stress on the workpiece surface, more uniform stress distribution, and avoiding functional wafer cracking and internal device damage. |