Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-375 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-375 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-375 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate |
2017-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_711c65c35e7e045e569cf55601a6e014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b55ec377d2b6818299c97eee4ec1729 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_799ab9c7c4326bfda40741f15b2796c4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ac2b764b29ed4cf7f4c5ff4b2968580 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9237ee492e60ef1153b1c49c202c6323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29998fafd7291481778e8c3c871149ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cbe29c58fffd6772772fc1be56184ef |
publicationDate |
2018-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I638231-B |
titleOfInvention |
Photosensitive resin composition, method for producing hardened relief pattern, and semiconductor device |
abstract |
A photosensitive resin composition containing a resin and a compound having a structure specified in this specification provides a cured film excellent in adhesion to copper wiring. |
priorityDate |
2016-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |