http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I636716-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4bbe0c235c848175f1f3f0b770e7f6f9 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49844 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22F1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1216 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate | 2014-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13c92317524a23c0f34694bcd559d541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e76b69c159d97af522a8c15fcbbab8a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1126ad52432ab64cb4435700458744d8 |
| publicationDate | 2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I636716-B |
| titleOfInvention | Method for manufacturing multi-plane metallized layer on ceramic substrate |
| abstract | A method for manufacturing a multi-plane metal plating layer composed of copper on a ceramic substrate, the ceramic substrate (4) is composed of AlN or Al 2 O 3 , wherein a high power region (1) and a weak power region (2) On the ceramic substrate (4), the high-power region (1) has a metal-plated layer with a higher current carrying capacity, and the low-power region (2) has a metal-plated layer with a smaller current carrying capacity. The method steps are sequentially implemented: (e) printing with a common underplated metal layer as the high power area (1) and the low power area (2), the underplated metal layer is made of a glass-containing copper base It is composed of solder paste, printed by screen printing or cotton swabs, with a thickness of 20-50 microns; (f) printing thick or thick with copper-free solder paste containing no glass component on this high-power area (1) The bottom metallization layer is used to thicken the bottom metallization layer, and screen printing or stencil printing is used until the total copper thickness is 300 to 500 microns; (g) The high power area (1) and the low power area ( 2) The metal-plated ceramic substrate (4) is burned together in nitrogen at 850 ~ 950 ° C; (h) the high power region (1) is mechanically leveled to make a flat surface Surface roughness R 2 <5 microns. In addition, a metal-plated substrate (4) is composed of AlN or Al 2 O 3 and has a multi-plane metal plating composed of copper, which has a high-power region (1) and a low-power region (2). The region (1) has a metal-plated layer with a larger electric-carrying capacity, and the weak power region (2) has a metal-plated layer with a smaller electric-carrying capacity, and the substrate is manufactured by using the method described above. The thickness of the metallization layer in 1) is 180 ~ 220 micrometers, the thickness of the metallization layer in the weak power region (2) is 20-50 micrometers, and the adhesion strength of the metallization layer exceeds 60N / mm2.n n n (figure 1) |
| priorityDate | 2013-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.