http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I636594-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48237 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 |
| filingDate | 2015-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b137ffd3db775dffd19f47e8e5baae7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0753218c46835e9b576fdafda491dba6 |
| publicationDate | 2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I636594-B |
| titleOfInvention | Method of manufacturing semiconductor light emitting device |
| abstract | A manufacturing method comprising a substrate, an element, and a sealing material as a constituent member of a semiconductor light-emitting device, comprising: a first step of disposing an element on a substrate, and is selected from the group consisting of an addition polymerization type sealing material and a polycondensation type sealing At least one pre-hardening sealing material (i) of the group formed by the material, the second step of injecting the sealing material (i) before the hardening into the substrate in a second step of covering the element, And the polycondensation type sealing material (ii) before hardening is poured onto the hardened sealing material (i) of the covered element, and the polycondensation type sealing material (ii) before the hardening is hardened, And a fourth step of laminating the sealing material; and a semiconductor light-emitting device formed by laminating two or more sealing materials by the semiconductor light-emitting device manufactured by the manufacturing method. |
| priorityDate | 2014-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 129.