| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09 |
| filingDate |
2013-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I636097-B |
| titleOfInvention |
Thermosetting resin composition, light-reflective anisotropic conductive adhesive, and light-emitting device |
| abstract |
The present invention provides a thermosetting resin composition for manufacturing a light-emitting device by flip-chip mounting a light-emitting element such as a light-emitting diode (LED) element to a wiring board using an anisotropic conductive adhesive. In addition, it is an insulating adhesive component which is suitable for an anisotropic conductive adhesive which exhibits a practically sufficient wafer shear strength which is not easily discolored by heat or light.nn n n The thermosetting resin composition of the present invention contains an epoxy group-containing oxirane compound represented by formula (1) and a curing agent for epoxy resin. In the formula (1), the substituent R is independently an alkyl group or a phenyl group. The linking group A is independently a divalent hydrocarbon group. The substituents R1 and R2 are independently an epoxy group-containing organic group, an alkyl group or an aryl group, wherein at least one of R1 and R2 is an epoxy group-containing organic group. |
| priorityDate |
2012-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |