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filingDate 2014-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_366121023f1cd08878ec341f91c26027
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publicationDate 2018-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I631231-B
titleOfInvention PECVD microcrystalline germanium (SIGE)
abstract Embodiments of the invention generally relate to methods for forming a SiGe layer. In one embodiment, a seed SiGe layer is first formed using plasma enhanced chemical vapor deposition (PECVD), and a bulk SiGe layer is also formed directly on the PECVD seed layer using PECVD. The processing temperature for both the seed SiGe layer and the bulk SiGe layer is less than 450 degrees Celsius.
priorityDate 2013-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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