| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0603 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
| filingDate |
2016-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234d9ff72968957446fe9a8e3ebc01df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93bd50287fe3757584a650043bab7b72 |
| publicationDate |
2018-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I631228-B |
| titleOfInvention |
Metal foil, release layer metal foil, laminate, printed circuit board, semiconductor package, electronic device, and printed circuit board manufacturing method |
| abstract |
The present invention provides a metal foil in which a release layer is provided on a metal foil, and when the metal foil is bonded to the resin substrate, the resin substrate can be physically peeled off, and the metal foil is removed from the resin substrate. In the step, the contour of the surface of the metal foil transferred to the surface of the resin substrate is not damaged, so that the metal foil can be removed at a good cost, and the resins having different resin components can be adhered to each other with good adhesion. It is a metal foil having a surface unevenness at a ratio of the maximum height Sz to the average interval Rsm of the irregularities (Sz/Rsm) of 0.5 to 3.0 on at least one side. |
| priorityDate |
2015-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |