http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I630857-B
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dca153f19868f747eeea612b047a9e7c |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7687 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-268 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76894 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38 |
filingDate | 2016-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2018-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab0b9a77c800adedd115b78c668d98de |
publicationDate | 2018-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-I630857-B |
titleOfInvention | Substrate manufacturing method and laser processing device |
abstract | The invention provides a substrate manufacturing method, which can improve the utilization efficiency of laser energy without increasing the coating accuracy of a material for absorbing the optical energy of infrared lasers. A surface layer film is formed by coating a liquid material of a surface layer film that absorbs light of an infrared region wavelength on a surface layer conductor layer of a substrate having a laminated structure stacked in the order of an internal conductor layer, an insulating layer and a surface layer conductor layer. When viewed in a plan view, a through-hole is formed in the surface-layer conductor layer and the insulating layer by a laser beam incident on the surface-layer film in the infrared region under the condition that a beam spot is arranged inside the surface-layer film. |
priorityDate | 2015-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.