http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I630641-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-08 |
| filingDate | 2012-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_329e3054458f4ade1f74e6321b433690 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c33b8a8b2768829e75b5533fe818e114 |
| publicationDate | 2018-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I630641-B |
| titleOfInvention | Film-like wafer molding material, stamped wafer, and semiconductor device |
| abstract | The object of the present invention is to provide a film having a good transfer performance for a large-diameter, thin film wafer, low warpage after molding (after molding), and good wafer protection performance, and is suitable for film-level packaging. Wafer molding material.nn n n The solution of the present invention is a film-like wafer molding material, which is a film-like wafer molding material for collectively embossing a wafer, characterized in that it has at least a first film layer and a layer on the first film layer. a multilayer structure formed by the second film layer, wherein the first film layer contains a polymer compound containing a polyoxymethylene skeleton, a crosslinking agent, and a filler, and the second film layer contains a polymer compound containing a polyoxyn skeleton and In addition, when the content ratio of the filler contained in the first film layer is taken as 100, the filler is contained in a content ratio of 0 or more and less than 100. |
| priorityDate | 2011-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.