| abstract |
The purpose of the present invention is to provide a high-temperature, high-humidity environment,nIt produces solder alloys, solder balls, wafer solders, solder pastes, and solder joints that discolor and suppress the growth of oxide films.nn n n This solder alloy system contains 0.005 mass% to 0.1 mass% of Mn, 0.001 mass% to 0.1 mass% of Ge, and the remaining main component is Sn. The solder alloy containing Sn as a main component contains Mn of 0.005 mass% to 0.1 mass%, and Ge of 0.001 mass% to 0.1 mass%. In the oxide film including Sn oxide, Mn oxide, and Ge oxide, Among them, Ge oxide is mostly distributed on the outermost surface of the oxide film, and the effect of preventing discoloration can be obtained even in a high humidity environment. In addition, the reaction between Mn and O 2 suppresses the reaction between Sn and O 2 and further suppresses the formation of Sn oxides, so the increase in the thickness of the oxide film is suppressed, and the fusion property is improved. |