| abstract |
The present invention is directed to an integrated conductive polymer solder ball structure and method of forming such an integrated conductive polymer solder ball structure. The integrated conductive polymer solder ball structure comprises: a sputtered seed layer applied to the wafer structure; one or more conductive polymer pad structures applied to the wafer structure to form one or more a sputtered seed layer at a location of the solder ball structure; a plating layer applied to the portion of the one or more conductive polymer pad structures exposed to the photoresist layer; and solder balls formed in each of the plating On the layer, thereby forming the one or more solder ball structures. |