http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I626150-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D2202-45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D7-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D7-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D7-14 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 |
| filingDate | 2014-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ae0cb2723317a9a63e190162841bab7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aac3ff98bc149e3a275b74dc5ad5c617 |
| publicationDate | 2018-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I626150-B |
| titleOfInvention | Composite copper foil and composite copper foil manufacturing method |
| abstract | The present invention provides a method for producing a composite copper foil and a composite copper foil which has high adhesion to a substrate while maintaining a transmittance of a substrate, the composite copper foil having a rolled copper foil and formed on a rolled copper foil a copper plating layer on at least one side of the copper plating layer and a roughened copper plating layer containing coarse particles having an average particle diameter of 0.05 μm or more and 0.30 μm or less on the copper plating layer, and a maximum particle size and a minimum particle diameter of the coarsened particles The percentage of the difference is 65% or less. In the cross section in which the roughened copper plating layer is cut from the thickness direction, the roughened grains are continuously connected to the copper plating layer without interruption at a distance of 20 μm or more. |
| priorityDate | 2013-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.