http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I625989-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2015-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d13965c1f3584cc5a48c8223a04880a3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d68be277b6b3f89b82c0b07b2e4f63e |
| publicationDate | 2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I625989-B |
| titleOfInvention | Copper foil and copper clad laminated board for printed wiring board |
| abstract | The present invention provides a copper foil for a wiring board and a copper-clad laminated board, which have good visibility after circuit patterns are formed, have high normal peel strength, and can maintain heat peel strength at a high level.nn n n A copper foil, a copper-clad laminated board, and a copper-clad laminated board having a polyimide resin layer containing a specific copper inhibitor on the one surface side of the copper foil. At least one surface has a roughened particle layer composed of roughened particles having an arithmetic average height of 0.05 to 0.5 μm, and the roughened particle layer has a diffusion preventing coating, and the diffusion preventing coating contains at least nickel and zinc. The ratio (mass ratio) of the adhesion amount of zinc to the roughened particle layer and the adhesion amount of nickel to the roughened particle layer is in the range of 0.5 to 20. Among them, the wavelength is 600 nm measured from the one surface side. The diffuse reflectance (R d ) is within a range of 5 to 50%, and the chroma (C * ) is 30 or less. |
| priorityDate | 2014-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 157.