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filingDate 2014-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad1c6a652029e8031874f58dda41a5fd
publicationDate 2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I625428-B
titleOfInvention Electroplating bath for tin or tin alloy and use thereof
abstract The problem of the present invention is to solve the problem that when the plating solution for tin or tin alloy plating used in the past is attempted to fill a through hole or a through hole, the filling itself cannot be performed satisfactorily, and even if the filling itself can be performed well, it is extremely long filling time. The problem. The plating solution for tin or tin alloy which solves this problem has the following components (a) and (b):nn n n (a) a compound containing a carboxyl groupnn n n (b) A carbonyl group-containing compound, wherein the component (a) is 1.3 g/L or more, and the component (b) is 0.3 g/L or more.
priorityDate 2013-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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