http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I625229-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234d9ff72968957446fe9a8e3ebc01df http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93bd50287fe3757584a650043bab7b72 |
| publicationDate | 2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I625229-B |
| titleOfInvention | Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method |
| abstract | The present invention provides a metal foil which is physically peeled off when the metal foil is bonded to a resin substrate by providing a release layer of the metal foil, thereby removing the metal foil from the resin substrate. In the step, the metal foil can be removed at a preferred cost without damaging the contour of the surface of the metal foil transferred onto the surface of the resin substrate, and the resins having different resin components can be bonded to each other with good adhesion. . The metal foil of the present invention has a surface profile: when a line is drawn on a photograph obtained by SEM imaging by at least one surface magnified to 3000 times magnification, and the number of metal particles falling on a straight line is counted, The number of particles in a straight line having a length of 10 μm (particle density = one/10 μm) is X, and the roughness Rz of the surface of the metal foil is Y, and the following formula (1) satisfies 2 to 9. |
| priorityDate | 2015-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 308.