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grantDate 2018-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I624966-B
titleOfInvention Light-emitting diode package
abstract A light emitting diode package device comprises a light emitting element, a light conversion layer disposed on the light emitting element, an encapsulation layer covering the light conversion layer, a white wall surrounding the encapsulation layer, and a diffusion film disposed on the The encapsulation layer is above the white wall. The light conversion layer has a light emitting surface, a light incident surface and a peripheral side surface, and the light incident surface faces the light emitting element. The white wall surrounds the peripheral side of the light conversion layer covered by the encapsulation layer.
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