| abstract |
The invention provides a positive photosensitive resin composition, which can improve the problem of peeling on metal wirings such as Cu and Al, electrodes, and substrates, especially on SiN substrates. A 2.38% TMAH aqueous solution is widely used in The developing solution can form a fine pattern in a shape pushed forward without drossing or smearing on the bottom of the pattern and the substrate. A positive photosensitive resin composition containing: (A) a polymer compound having a siloxane chain, which has a repeating unit represented by the following general formula (1) and a weight average molecular weight of 3,000 to 500,000; (B) due to light A photosensitive material that generates an acid and has an increased dissolution rate with respect to an alkaline aqueous solution; (C) a crosslinking agent; and (D) a solvent. [Chemical 1] |