Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6580bdbcebab0189b1f8ab0de6d1116 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 |
filingDate |
2014-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2858cccf3e0d2ba6cc3f5fe8495e7f0e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_367c76ee19ae7d9ff4f4048fed47e06c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0a393b734507efd1efd023c5311a256 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_175ca702cabbda871d197cc7222b0e77 |
publicationDate |
2018-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I624728-B |
titleOfInvention |
Photocurable thermosetting resin composition for producing a printed circuit board, dry film, cured product, and printed circuit board |
abstract |
The present invention provides a photocurable thermosetting resin composition, a dry film, a cured product, and a printed circuit board for producing a printed wiring board. The photocurable thermosetting resin composition for producing a printed circuit board is characterized by comprising: (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a photosensitive monomer, and (D) A thermosetting component and (E) a hollow filler. |
priorityDate |
2014-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |