| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate |
2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93bd50287fe3757584a650043bab7b72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234d9ff72968957446fe9a8e3ebc01df |
| publicationDate |
2018-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I618814-B |
| titleOfInvention |
Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method |
| abstract |
The present invention provides a metal foil which is physically peeled off when the metal foil is bonded to a resin substrate by providing a release layer of the metal foil, thereby removing the metal foil from the resin substrate. In the step, the metal foil can be removed at a preferred cost without damaging the contour of the surface of the metal foil transferred onto the surface of the resin substrate, and the resins having different resin components can be bonded to each other with good adhesion. . The metal foil of the present invention has a surface treatment layer on at least one surface, and the water contact angle of the side surface of the surface treatment layer is 90 degrees or more. |
| priorityDate |
2015-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |