| abstract |
The present invention provides a chemical mechanical polishing composition comprising (a) an abrasive material selected from the group consisting of wet silica, alpha alumina, fumed alumina, ceria, zirconia, titania, and combinations thereof, (b) Oxidation catalyst, (c) non-transition metal sulfate, (d) complexing agent, (e) hydrogen peroxide, (f) non-ionic surfactant, (g) anionic surfactant, and (h) water. The polishing composition has a pH of about 1 to about 5, and the polishing composition is substantially free of peroxodisulfate. The present invention also provides a method for chemically mechanically polishing a substrate, especially a nickel-phosphorus substrate, by contacting the substrate with a polishing pad and the chemical mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and polishing At least a portion of the substrate is used to polish the substrate. |