abstract |
A method of forming a sealing barrier layer includes the steps of: sputtering a target from a sputter target, wherein the sputter target comprises a sputter material, such as a low Tg glass, a low Tg glass precursor, or a copper or tin oxide. Things. During sputtering, defect formation in the barrier layer is limited to a narrow range and the sputter material is maintained at a temperature of less than 200 °C. |