| abstract |
The present invention provides a composition for a three-dimensional integrated circuit, which uses boron nitride agglomerated particles with excellent isotropic properties of heat conduction, collapse resistance, and kneadability with resin, and can form a thermal conductivity in a thickness direction. Interlayer filling layer.nn n n The invention is a composition for a three-dimensional integrated circuit, which comprises: boron nitride aggregated particles, boron nitride aggregated particles having a specific surface area of 10 m 2 / g or more, and the surface of the boron nitride aggregated particles is composed of average particles. It is composed of boron nitride primary particles with a diameter of 0.05 μm or more and 1 μm or less, and is a spherical boron nitride agglomerated particle; and a resin (A) having a melt viscosity at 120 ° C. of 100 Pa · s or less. |