Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1368 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G09F9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G09F9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1368 |
filingDate |
2016-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51303c9201fc266502520aedc1693ffc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10c277abd435cb35823ede8e66226671 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ac176c466b1c59856c25456c2d1ac9e |
publicationDate |
2018-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I614856-B |
titleOfInvention |
COF type semiconductor package and liquid crystal display device |
abstract |
A COF-type semiconductor package according to the present invention includes: a film; and a wafer attached to the aforementioned film; and a heat radiation sheet provided on the wafer, sequentially provided with an adhesive layer, a metal layer, containing a heat radiation filler, and bonding. Heat radiation layer and insulation layer of the agent. |
priorityDate |
2015-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |