http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I614572-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2014-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5f27808cdbccbc0fc0bc792074374c2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66eef508ba68bb11b830dba019b52258 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ae233ec4f9cff125dc4a41ddcd5aa4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76a5fe3304e5f90cfa2b2bde76c58f28 |
| publicationDate | 2018-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I614572-B |
| titleOfInvention | Photosensitive thermosetting resin composition for flexible printed wiring board, dry film, and flexible printed wiring board |
| abstract | The present invention provides an insulating film for a flexible printed wiring board that is excellent in reliability such as impact resistance and bendability, processing accuracy, and excellent workability, and is particularly suitable for bending portions (bending portions) and mounting Parts (non-bent parts), a photosensitive thermosetting resin composition for a flexible printed wiring board forming a process together, a dry film having a resin layer formed by the photosensitive thermosetting resin composition, and having the curing As a protective film, it is a flexible printed wiring board with excellent reliability such as impact resistance and bendability.nn n n The present invention is a photosensitive thermosetting resin composition for flexible printed wiring boards containing an alkali-soluble resin having an imide ring, a photobase generator, and a heat-reactive compound. And, a flexible printed wiring board having a cured product made of a resin layer of a photosensitive thermosetting resin composition for a flexible printed wiring board. |
| priorityDate | 2013-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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