http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I611738-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2015-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7e4e1500d7d0e6579c402d418cf0851 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d87d7b9ad64f60e219422dda68a53b90 |
| publicationDate | 2018-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I611738-B |
| titleOfInvention | High-frequency signal transmission circuit forming surface-treated copper foil, high-frequency signal transmission printed circuit board manufacturing copper-clad laminate and high-frequency signal transmission printed circuit board |
| abstract | The invention aims at providing a surface-treated copper foil provided with a roughened layer of a circuit that does not show a roughened layer when a high-frequency signal is transmitted, and can obtain a roughened layer of a circuit according to a designed signal transmission speed. In order to achieve this, a surface-treated copper foil or the like for forming a high-frequency signal transmission circuit is used, which is characterized in that it is a surface-treated copper foil having a roughened layer on the surface of the copper foil. Needle-shaped or plate-shaped fine irregularities composed of a copper composite compound containing copper oxide and cuprous oxide, and the copper layer has an average crystal grain size of 2.5 μm or more when the copper foil is viewed in cross section. |
| priorityDate | 2014-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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