| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00 |
| filingDate |
2015-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e74ccdafd74bbee29f3e7c8e37613d5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37a5f04591174e1740e62ddf0a6902cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12ac655455ca4f799ce6b06000780258 |
| publicationDate |
2018-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I609996-B |
| titleOfInvention |
Electrochemical plating method |
| abstract |
An electrochemical process for applying a conductive film to a substrate having a seed layer comprises placing the substrate in an electrochemical plating bath contacting a cobalt or nickel salt, and the pH of the plating bath is from 4.0 to 9.0. Current is directed through the bath to the substrate. Cobalt or nickel ions in the bath are deposited onto the seed layer. The electroplating bath may contain cobalt chloride and glycine. The current can be 1-50 mA/cm 2 . After the electrochemical process is completed, the substrate is removed from the plating bath, rinsed and dried, and then annealed at a temperature of 200 ° C to 400 ° C to improve material properties and reduce seam line defects. The plating and annealing processes can be repeated multiple times. |
| priorityDate |
2014-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |